DocumentCode
1847939
Title
Thermal considerations in cooling large scale high compute density data centers
Author
Patel, Chandrakant D. ; Sharma, Ratnesh ; Bash, Cullen E. ; Beitelmal, Abdlmonem
Author_Institution
Hewlett-Packard Labs., Palo Alto, CA, USA
fYear
2002
fDate
2002
Firstpage
767
Lastpage
776
Abstract
A high compute density data center of today is characterized as one consisting of thousands of racks each with multiple computing units. The computing units include multiple microprocessors, each dissipating approximately 250 W of power. The heat dissipation from a rack containing such computing units exceeds 10 KW. Today´s data center, with 1000 racks, over 30,000 square feet, requires 10 MW of power for the computing infrastructure. A 100,000 square foot data center of tomorrow will require 50 MW of power for the computing infrastructure. Energy required to dissipate this heat will be an additional 20 MW. A hundred thousand square foot planetary scale data center, with five thousand 10 KW racks, would cost ∼$44 million per year (@ $100/MWh) just to power the servers & $18 million per year to power the cooling infrastructure for the data center. Cooling design considerations by virtue of proper layout of racks can yield substantial savings in energy. This paper shows an overview of a data center cooling design and presents the results of a case study where layout change was made by virtue of numerical modeling to avail efficient use of air conditioning resources.
Keywords
air conditioning; computer centres; cooling; thermal management (packaging); air conditioning; computing infrastructure; cooling design; data center; heat dissipation; multiple microprocessors; numerical model; power dissipation; rack layout; thermal management; Air conditioning; Computational fluid dynamics; Cooling; Data mining; Foot; Large-scale systems; Numerical models; Power system modeling; Temperature distribution; Thermal management;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal and Thermomechanical Phenomena in Electronic Systems, 2002. ITHERM 2002. The Eighth Intersociety Conference on
ISSN
1089-9870
Print_ISBN
0-7803-7152-6
Type
conf
DOI
10.1109/ITHERM.2002.1012532
Filename
1012532
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