DocumentCode :
1848365
Title :
Relating sinusoid to random vibration for electronic packaging testing
Author :
Wang, Frank Fan
Author_Institution :
Eldec Co., Lynnwood, WA, USA
fYear :
2002
fDate :
2002
Firstpage :
892
Lastpage :
895
Abstract :
There are two acceptable exercises of evaluating the electronics against vibration damage. They are sinusoid vibration, and random vibration testing. The differences of these two tests are obvious. Their characterizations of vibration are based on distinctly different sets of mathematics. This paper will discuss a method to relate one testing result to the other. The method to relate these two testing methods is based on the equivalent damage theory of the electronics packaging. The theory is that if one testing method causes the same kinds of damaging effects as the other testing method, the results can then be related.
Keywords :
circuit reliability; dynamic testing; packaging; production testing; spectral analysis; vibrations; differential equation; electrodynamics shaker; electronic packaging testing; equivalent damage theory; mechanical shaker; power spectral density definition; random vibration testing; reliability; sine dwell; sine sweep; sinusoid vibration testing; vibration damage; Acceleration; Damping; Electronic equipment testing; Electronics packaging; Life estimation; Mathematics; Qualifications; Resonance; Resonant frequency; Vibrations;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems, 2002. ITHERM 2002. The Eighth Intersociety Conference on
ISSN :
1089-9870
Print_ISBN :
0-7803-7152-6
Type :
conf
DOI :
10.1109/ITHERM.2002.1012549
Filename :
1012549
Link To Document :
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