Thermomechanical reliability of high density wiring substrates

Author

Hedge, S. ; Pucha, Raghuram V. ; Takahashi, Atsushi ; Takano, Nozomu ; Sitaraman, Suresh K.

Author_Institution

George W. Woodruff Sch. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA, USA

fYear

2002

fDate

2002

Firstpage

919

Lastpage

925

Abstract

The thermomechanical response of multi-layered high density wiring (HDW) substrates is influenced by various material and geometrical parameters. This study aims at understanding the role and interaction of various dielectric and base substrate materials on different failure mechanisms. Experimental thermals cycling results are presented and the failure modes observed in test samples are discussed. Nonlinear finite element models are developed to estimate the warpage of the substrate, stresses in the dielectric layer and solder bump strains. The input factors for the analysis are grouped under material properties and geometry, and a selection technique is used to identify important factors. Based on the study, a response surface is generated to understand the role and interaction of input parameters on various failure mechanisms, and such a response surface will be used to tailor material properties for the High Density Wiring (HDW) structures.

Keywords

chip-on-board packaging; failure analysis; finite element analysis; flip-chip devices; reliability; wiring; base substrate materials; failure mechanisms; failure modes; geometrical parameters; input parameters; material parameters; multilayered high density wiring substrates; nonlinear finite element models; response surface; solder bump strains; thermal cycling; thermomechanical reliability; warpage; Dielectric materials; Dielectric substrates; Failure analysis; Finite element methods; Material properties; Response surface methodology; Testing; Thermal stresses; Thermomechanical processes; Wiring;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal and Thermomechanical Phenomena in Electronic Systems, 2002. ITHERM 2002. The Eighth Intersociety Conference on

ISSN

1089-9870

Print_ISBN

0-7803-7152-6

Type

conf

DOI

10.1109/ITHERM.2002.1012554

Filename

1012554