DocumentCode :
1848693
Title :
Experimental study of failure mechanisms in particle filled acrylic composites
Author :
Basaran, Cemal ; Nie, Shihua ; Hutchins, Clyde S.
Author_Institution :
Dept. of Civil, Struct. & Environ. Eng., State Univ. of New York, Buffalo, NY, USA
fYear :
2002
fDate :
2002
Firstpage :
979
Lastpage :
986
Abstract :
Particle filled solid surface composites are used to fabricate kitchen countertops and sinks which may be subjected to severe temperature variations, giving rise to high thermal stresses. These stresses may lead to failure by cracking in regions subjected to large temperature variation. An aim of this paper is to investigate mechanisms of failure in solid surface materials using in situ observations during tensile, compressive and fatigue loading and to define test configurations that give meaningful measurements of material properties. Experiments show that the failure in tension occurs in several stages. In flexural loading the failure process is more complex. Consequently, flexural testing should not be used as a substitute for the measurement of ultimate tensile strength in a particle filled solid surface composite. The application of conventional damage mechanics to describe the failure of test specimens is also discussed.
Keywords :
brittle fracture; failure analysis; fatigue; filled polymers; particle reinforced composites; tensile strength; thermal stress cracking; thermal stresses; brittle materials; compressive loading; cracking; damage mechanics; failure mechanisms; fatigue loading; flexural loading; high thermal stresses; in situ observations; kitchen countertops; kitchen sinks; material properties; particle filled acrylic composites; particulate composites; severe temperature variations; solid surface composites; tensile loading; tensile strength; test configurations; Compressive stress; Failure analysis; Fatigue; Material properties; Materials testing; Solids; Surface cracks; Temperature; Tensile stress; Thermal stresses;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems, 2002. ITHERM 2002. The Eighth Intersociety Conference on
ISSN :
1089-9870
Print_ISBN :
0-7803-7152-6
Type :
conf
DOI :
10.1109/ITHERM.2002.1012563
Filename :
1012563
Link To Document :
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