Title :
Thermal considerations for distributed power converter systems
Author :
Ridley, Ray ; Reynell, Michael ; Kern, Siegfried
Author_Institution :
Ridley Eng., Battle Creek, MI, USA
Abstract :
Thermal design examples are presented for typical DC-DC systems. A three-dimensional thermal modeling tool is used to predict temperature rise. The simulations presented show that great care must be taken in accurately modeling or thermally testing even a simple power system such as the single DC-DC converter on a PC board. When natural convection cooling is used, the temperature changes can be very counter-intuitive. Software for predicting temperature profiles can be a powerful design aid for reducing wasted experimental effort and laboratory testing
Keywords :
cooling; electronic engineering computing; packaging; power convertors; printed circuits; PC board; distributed power converter systems; natural convection cooling; single DC-DC converter; software; temperature rise prediction; thermal considerations; three-dimensional thermal modeling tool; Cooling; DC-DC power converters; Frequency; Heat sinks; Packaging; Power supplies; Power system modeling; Power system reliability; Predictive models; Temperature;
Conference_Titel :
Applied Power Electronics Conference and Exposition, 1993. APEC '93. Conference Proceedings 1993., Eighth Annual
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-0983-9
DOI :
10.1109/APEC.1993.290729
