DocumentCode
1848805
Title
Accurate Probing of RF Amplifiers Using Vertical Interconnect Boards
Author
Naishadham, Krishna
Author_Institution
Dept. 530, RF Engineering R&D Division, Philips Broadband Networks, Inc., 100 Fairgrounds Drive, Manlius, NY 13104, Email: krishna.naishadham@philips.com, Tel. (315) 682-9157, x 2117, Fax: (315) 682-2279
Volume
38
fYear
2000
fDate
Nov. 2000
Firstpage
1
Lastpage
5
Abstract
Printed circuit boards with plug-in pins and edge-connectors for insertion into appropriate sockets on a mother-board are used in the electronics industry as functional circuit blocks. For example, functions such as additional RAM can be added to a personal computer by inserting cards with edge connectors to mate with the CPU mother-board. In RF amplifiers used in high-speed data transmission, video communication and broadband cable television, plug-in circuit boards save considerable real estate on the mother-board and facilitate plug-and-play convenience. At RF and microwave frequencies, it is very important to characterize the pin-socket interface on the mother-board so that the influence of its mismatch and other parasitic effects can be incorporated in the circuit design. In this paper, we discuss a calibration technique to compensate for such mismatch, and present measured data on a high-gain amplifier.
Keywords
Connectors; Data communication; Electronics industry; Integrated circuit interconnections; Microcomputers; Pins; Printed circuits; Radiofrequency amplifiers; Read-write memory; Sockets;
fLanguage
English
Publisher
ieee
Conference_Titel
ARFTG Conference Digest-Fall, 56th
Conference_Location
Boulder, AZ, USA
Print_ISBN
0-7803-5686-1
Type
conf
DOI
10.1109/ARFTG.2000.327427
Filename
4120126
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