Title :
Multi-chip modules for military and adverse environment applications
Author_Institution :
Hughes Aircraft Co., Los Angeles, CA, USA
Abstract :
This paper covers some of the design, inspection, and test tradeoffs involved in creating modern high-performance MCMs for both military and high-end commercial applications with an adverse environment. Some current military design, inspection and qualification requirements need to be reviewed for their true value. On the other hand, design features can be incorporated to ensure that system performance and reliability are enhanced, even as the amount and cost of inspection and testing are reduced. As the influence of military business declines with respect to the commercial marketplace, common solutions to common problems must be found
Keywords :
electronic equipment testing; inspection; military equipment; multichip modules; production testing; reliability; adverse environment; commercial applications; cost; inspection; military applications; multichip modules; qualification requirements; reliability; system performance; testing; Assembly; Circuit testing; Costs; Inspection; Lead; Military aircraft; Packaging; Qualifications; Temperature; Throughput;
Conference_Titel :
Aerospace and Electronics Conference, 1993. NAECON 1993., Proceedings of the IEEE 1993 National
Conference_Location :
Dayton, OH
Print_ISBN :
0-7803-1295-3
DOI :
10.1109/NAECON.1993.290778