Title :
Sub-Wavelength Grating Lenses With a Twist
Author :
Vo, Sonny ; Fattal, David ; Sorin, W.V. ; Zhen Peng ; Tho Tran ; Fiorentino, M. ; Beausoleil, Raymond G.
Author_Institution :
Hewlett-Packard Labs., Palo Alto, CA, USA
Abstract :
Dielectric high-contrast sub-wavelength grating (SWG) structures have received much attention in recent years, offering a new paradigm for the integration of optical systems. Their nanoscale resonant properties can result in a complex and unintuitive far-field behavior that, if carefully crafted, allows the full control of the optical phase front from a thin sub-wavelength planar layer. To date, experimental demonstrations of these new devices have only been realized with polarized light in a reflective mode, greatly limiting their use for practical systems. In this letter, we demonstrate a highly efficient, sub-wavelength thick, transmissive grating lens configuration using symmetrical resonant posts to achieve polarization-independent operation. Our transmissive SWG lenses are easily fabricated using low-cost scalable semiconductor process technology. To illustrate their performance, we demonstrate the generation of high-order orbital angular momentum beams and their use in an optical mode-isolator application that achieves a suppression ratio of over 25 dB.
Keywords :
diffraction gratings; lenses; light polarisation; light transmission; optical fabrication; optical isolators; dielectric high-contrast subwavelength grating structures; high-order orbital angular momentum beam generation; light polarization; light reflection; low-cost scalable semiconductor process technology; nanoscale resonant properties; optical fabrication; optical mode-isolator application; optical phase front control; optical system integration; subwavelength grating lenses; transmissive SWG lenses; Diffraction gratings; Gratings; Indexes; Lenses; Optical reflection; Silicon; Sub-wavelength grating; mode isolator; orbital angular momentum; phase front; polarization independent;
Journal_Title :
Photonics Technology Letters, IEEE
DOI :
10.1109/LPT.2014.2325947