Coplanar waveguide based, dielectric coated flip chip monolithic microwave integrated circuit, a paradigm shift in MMIC technology

Author

Wen, C.P. ; Wong, W.D. ; Pao, C.K. ; Snopkowski, J.L. ; Ingram, D.L.

Author_Institution

GM Hughes Electron. Co., Torrance, CA, USA

fYear

1995

fDate

15-16 May 1995

Firstpage

123

Lastpage

126

Abstract

The status of a coplanar waveguide based, novel dielectric coated, mechanically rugged, flip-chip, monolithic microwave integrated circuit (MMIC) technology will be described. This technology is ideal for low-cost, multi-chip transmit/receive (T/R) module applications. Equivalent circuit and thermal models, and the fabrication procedure of flip-chip MMICs featuring T-shaped plated silver thermal bumps will be presented along with test results obtained on components designed using these circuit element models.<>

Keywords

MMIC; coplanar waveguides; equivalent circuits; flip-chip devices; integrated circuit technology; Ag; T-shaped plated silver thermal bumps; coplanar waveguide; dielectric coating; equivalent circuit; fabrication; flip chip MMIC; mechanical ruggedness; monolithic microwave integrated circuit; multi-chip transmit/receive module; thermal model; Circuit testing; Coplanar waveguides; Dielectrics; Equivalent circuits; Flip chip; Integrated circuit technology; MMICs; Microwave integrated circuits; Microwave technology; Monolithic integrated circuits;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave and Millimeter-Wave Monolithic Circuits Symposium, 1995. Digest of Papers., IEEE 1995

Conference_Location

Orlando, FL, USA

Print_ISBN

0-7803-2590-7

Type

conf

DOI

10.1109/MCS.1995.470976

Filename

470976