Title :
Coplanar waveguide based, dielectric coated flip chip monolithic microwave integrated circuit, a paradigm shift in MMIC technology
Author :
Wen, C.P. ; Wong, W.D. ; Pao, C.K. ; Snopkowski, J.L. ; Ingram, D.L.
Author_Institution :
GM Hughes Electron. Co., Torrance, CA, USA
Abstract :
The status of a coplanar waveguide based, novel dielectric coated, mechanically rugged, flip-chip, monolithic microwave integrated circuit (MMIC) technology will be described. This technology is ideal for low-cost, multi-chip transmit/receive (T/R) module applications. Equivalent circuit and thermal models, and the fabrication procedure of flip-chip MMICs featuring T-shaped plated silver thermal bumps will be presented along with test results obtained on components designed using these circuit element models.<>
Keywords :
MMIC; coplanar waveguides; equivalent circuits; flip-chip devices; integrated circuit technology; Ag; T-shaped plated silver thermal bumps; coplanar waveguide; dielectric coating; equivalent circuit; fabrication; flip chip MMIC; mechanical ruggedness; monolithic microwave integrated circuit; multi-chip transmit/receive module; thermal model; Circuit testing; Coplanar waveguides; Dielectrics; Equivalent circuits; Flip chip; Integrated circuit technology; MMICs; Microwave integrated circuits; Microwave technology; Monolithic integrated circuits;
Conference_Titel :
Microwave and Millimeter-Wave Monolithic Circuits Symposium, 1995. Digest of Papers., IEEE 1995
Conference_Location :
Orlando, FL, USA
Print_ISBN :
0-7803-2590-7
DOI :
10.1109/MCS.1995.470976
