De-embedding and EM simulations for microstrip over lossy silicon

Author

Jiming Song ; Feng Ling ; Blood, W. ; Demircan, E. ; Sriram, K. ; Kun-Hin To ; Tsai, R. ; Qiang Li ; Myers, T. ; Petras, M.

Author_Institution

Dept. of Electr. Eng. & Comput. Eng., Iowa State Univ., Ames, IA, USA

Volume

3

fYear

2003

fDate

22-27 June 2003

Firstpage

973

Abstract

We summarize several de-embedding techniques and propose an approach using a 2-impedance model, which has one shunt and one series impedance that gives consistent results when applied to three different lengths of microstrip. We also discuss results on microstrip lines having a ground metal thickness less than a skin depth, and show the impact of the layers below thin grounds on simulations. Very good agreement is obtained between simulated and de-embedded measured results.

Keywords

capacitance; finite element analysis; impedance matching; inductance; microstrip lines; transmission line theory; two-port networks; 2-impedance model; EM simulations; S-parameter; Y-parameter; capacitance; cascaded two-port networks; conductance; de-embedding techniques; different microstrip lengths; finite element method; ground metal thickness; inductance; lossy silicon; microstrip lines; thin grounds; Computational modeling; Computer aided manufacturing; Impedance measurement; Microstrip; Radio frequency; Silicon; Skin; Tellurium; Transmission line matrix methods; Transmission line measurements;

fLanguage

English

Publisher

ieee

Conference_Titel

Antennas and Propagation Society International Symposium, 2003. IEEE

Conference_Location

Columbus, OH, USA

Print_ISBN

0-7803-7846-6

Type

conf

DOI

10.1109/APS.2003.1220073

Filename

1220073