DocumentCode :
1851384
Title :
A Franco-American cooperative design of VAMP avionics modules
Author :
Noel, P. ; Schelling, E.R.
Author_Institution :
Dassault Electron., Saint Cloud, France
fYear :
1993
fDate :
24-28 May 1993
Firstpage :
751
Abstract :
A cooperative program has been undertaken since 1989 between Westinghouse Electric Corporation and Dassault Electronique, through a Memorandum of Understanding (MOU) agreed upon by USAF and DGA (French DoD). This joint effort has been carried out under the VHSIC Avionics Modular Processor (VAMP) program. The goal was the development of three advanced avionic modules for the French DoD´s and USAF´s programs: PMF, a 32-bit military processor originally developed for different uses (Avionics, Navy, Army); NVM module, non-volatile memory (8 mbytes EEPROM); HSDB module, bus interface unit for the High Speed Data Bus (Referring to the AS 4074 Linear Token Passing Bus (LTPB) standard). This effort aims at establishing a high degree of interoperability for future NATO systems. These modules were designed under an equally balanced program in which studies and development were to be shared. The paper outlines the key technical issues in the development of each of these modules. It shows also how these modules are integrated and used in the Wright Laboratory Integrated Test Bed and what could be an associated future development
Keywords :
EPROM; VLSI; aircraft instrumentation; integrated memory circuits; microprocessor chips; military computing; military systems; network interfaces; protocols; standards; 32 bit; AS 4074 Linear Token Passing Bus; Army; DGA; Dassault Electronique; EEPROM; Franco-American cooperative design; French DoD; High Speed Data Bus; NATO; NVM module; Navy; PMF; USAF; VAMP avionics modules; VHSIC Avionics Modular Processor; Westinghouse Electric Corporation; Wright Laboratory Integrated Test Bed; bus interface; military processor; nonvolatile memory; Aerospace electronics; Coprocessors; EPROM; Integrated circuit technology; Manufacturing; Military standards; Nonvolatile memory; Packaging; Transport protocols; Very high speed integrated circuits;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Aerospace and Electronics Conference, 1993. NAECON 1993., Proceedings of the IEEE 1993 National
Conference_Location :
Dayton, OH
Print_ISBN :
0-7803-1295-3
Type :
conf
DOI :
10.1109/NAECON.1993.290847
Filename :
290847
Link To Document :
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