Simulation of crosstalk through bonding and package in mixed-signal CMOS ICs

This paper presents an approach for the simulation of mixed-signal CMOS integrated circuits, aiming at estimating crosstalk effects, by identifying possible sources of disturbances in analog-digital integrated systems, such as current pulses drawn from voltage supplies. A simple expression of voltage and current in the pull-up and the pull-down of a CMOS logic gate can be derived. A computer program demonstrates the feasibility of the proposed approach, and a representation of digital switching noise in time domain has been derived. This representation has been used to perform an analog simulation using SPECTRE, to evaluate the propagation of the switching noise through the parasitic elements of the package and of the bonding wires.