• DocumentCode
    1851821
  • Title

    Frequency scaling and transducer efficiency in internal dielectrically transduced silicon bar resonators

  • Author

    Weinstein, Dana ; Bhave, Sunil A. ; Morita, Shinya ; Mitarai, Shun ; Ikeda, Koichi

  • Author_Institution
    OxideMEMS Lab., Cornell Univ., Ithaca, NY, USA
  • fYear
    2009
  • fDate
    21-25 June 2009
  • Firstpage
    708
  • Lastpage
    711
  • Abstract
    In this paper, we present experimental results of frequency scaling and transducer optimization in internal dielectrically transduced silicon bar resonators. We show that selective positioning of the dielectric transducers inside the resonator can preferentially excite targeted harmonics while suppressing undesired modes. Furthermore, measurements across multiple resonators show lower motional impedance as resonant frequency increases and as the dielectric thickness approaches the acoustic half-wave length in silicon. With dielectric films at positions of maximum strain (minimum displacement) in the resonator, a 6.2 GHz resonator is demonstrated with a Q of 4277. We also report an fmiddotQ product of 3.1middot1013 at 4.7 GHz, the highest fmiddotQ product in polysilicon reported to date.
  • Keywords
    dielectric thin films; elemental semiconductors; micromechanical resonators; optimisation; silicon; transducers; Si; acoustic half-wave length; dielectric films; dielectric thickness; frequency 4.7 GHz to 6.2 GHz; frequency scaling; internal dielectrically transduced silicon bar resonators; polysilicon; transducer efficiency; transducer optimization; Acoustic measurements; Acoustic transducers; Dielectric films; Dielectric measurements; Frequency measurement; Impedance measurement; Length measurement; Resonant frequency; Silicon; Thickness measurement; RF MEMS; dielectric transduction; resonator;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009. International
  • Conference_Location
    Denver, CO
  • Print_ISBN
    978-1-4244-4190-7
  • Electronic_ISBN
    978-1-4244-4193-8
  • Type

    conf

  • DOI
    10.1109/SENSOR.2009.5285422
  • Filename
    5285422