Title :
MLFMA analysis of finite aperture arrays including reflector
Author :
Rullhusen, I. ; Arndt, F.
Author_Institution :
Microwave Dept., Bremen Univ., Germany
Abstract :
An extended multilevel fast multipole algorithm (MLFMA) formulation is presented that includes magnetic surface current densities of radiating apertures and impedance relations containing modal excitation terms. The method-of-moment (MoM) solution is based on a combined field integral equation (CFIE) written in terms of mixed potential form. Aperture waveguide modal eigenvectors and Rao-Wilton-Glisson (RWG) functions for triangular patches are utilized for basis functions of the magnetic and electric surface current densities, respectively. The applicability of the method is demonstrated at the examples of a rectangular horn cluster in a finite screen and a finite circular horn cluster feeding a subreflector. Advantages and disadvantages of the MLFMA, when applied for aperture array problems, are discussed. The method is verified by available measurements and reference calculations.
Keywords :
antenna arrays; antenna theory; aperture antennas; current density; eigenvalues and eigenfunctions; electric field integral equations; horn antennas; magnetic field integral equations; method of moments; reflector antennas; CFIE; MLFMA; MLFMA analysis; MoM; Rao-Wilton-Glisson functions; aperture waveguide modal eigenvectors; basis functions; combined field integral equation; electric surface current densities; finite aperture arrays; finite circular horn cluster; finite screen; impedance relations; magnetic surface current densities; method-of-moment; modal excitation terms; multilevel fast multipole algorithm; radiating apertures; rectangular horn cluster; reflector; subreflector; triangular patch RWG functions; Apertures; Current density; Feeds; Integral equations; MLFMA; Magnetic analysis; Message-oriented middleware; Microwave antenna arrays; Scattering; Transmission line matrix methods;
Conference_Titel :
Antennas and Propagation Society International Symposium, 2003. IEEE
Conference_Location :
Columbus, OH, USA
Print_ISBN :
0-7803-7846-6
DOI :
10.1109/APS.2003.1220111