Title :
A Joule-Thomson cooling system with a Si/glass heat exchanger for 0.1–1 w heat loads
Author :
Zhu, Weibin ; White, Michael J. ; Nellis, Gregory F. ; Klein, Sanford A. ; Giancha, Yogesh B.
Author_Institution :
Dept. of Mech. Eng., Univ. of Michigan, Ann Arbor, MI, USA
Abstract :
This paper reports a Joule-Thomson cooling system that provides 0.1-1 W cooling power using a micromachined Si/glass perforated plate heat exchanger. The gas expansion is performed through a micromachined valve that is piezoelectrically actuated, or alternatively through a commercial jewel orifice. The modulated J-T system using the microvalve can achieve 254.5 K at a pressure difference of 430 kPa and 5-8 K temperature modulation at a given pressure. With a jewel orifice, the temperature at the expansion orifice drops 76.1 K from the inlet temperature for an inlet pressure of 1 MPa (145 psia) when the ethane mass flow rate is 0.269 g/s. The system can reach a lower temperature at 200.3 K in a transient state. The cooling power of the system is 200 mW at 228K and 1 W at 239 K, in addition to a parasitic heat load of 300-500 mW.
Keywords :
Joule-Thomson effect; cooling; heat exchangers; microvalves; Joule-Thomson cooling system; Si-SiO2; commercial jewel orifice; gas expansion; micromachined Si/glass perforated plate heat exchanger; micromachined valve; piezoelectrical actuation; power 0.1 W to 1 W; power 200 mW; power 300 mW to 500 mW; pressure 1 MPa; temperature 228 K; temperature 239 K; temperature 5 K to 8 K; Cooling; Fabrication; Glass; Heat engines; Mechanical engineering; Microvalves; Orifices; Refrigeration; Temperature; Valves; Cryogenic; Flow Modulation; Heat Exchanger; Joule-Thomson Cooler; Microsystem;
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009. International
Conference_Location :
Denver, CO
Print_ISBN :
978-1-4244-4190-7
Electronic_ISBN :
978-1-4244-4193-8
DOI :
10.1109/SENSOR.2009.5285432
