Title :
Designing-in plastics, polymers, and novel materials in your electronics products
Author_Institution :
Inst. for Plastics Innovation, Massachusetts Univ., Lowell, MA, USA
Abstract :
The author presents a brief overview of the applications of plastics in electronics packaging. He deals with materials processing and properties and encapsulation of integrated circuit devices and briefly discusses the role of the Institute for Plastics Innovation
Keywords :
encapsulation; integrated circuit packaging; plastic packaging; polymers; Institute for Plastics Innovation; electronics packaging; encapsulation; integrated circuit devices; materials processing; materials properties; overview; plastics packaging; polymers; Conducting materials; Construction industry; Electronics industry; Electronics packaging; Industrial electronics; Manufacturing industries; Plastic products; Plastics industry; Polymers; Technological innovation;
Conference_Titel :
Electro/95 International. Professional Program Proceedings.
Conference_Location :
Boston, MA
Print_ISBN :
0-7803-2633-4
DOI :
10.1109/ELECTR.1995.471031
