DocumentCode
1852283
Title
An overview of the VSPA semiconductor package
Author
Portuondo, Maria M.
fYear
1995
fDate
21-23 Jun 1995
Firstpage
289
Lastpage
300
Abstract
The author presents a brief overview of VSPA characteristics including materials technology, wire routing layout, three tier wire bonding, pre-fab assembly, the surface mount package for multichip modules, packaging real estate, and performance characteristics
Keywords
Semiconductor device packaging;
fLanguage
English
Publisher
ieee
Conference_Titel
Electro/95 International. Professional Program Proceedings.
Conference_Location
Boston, MA
Print_ISBN
0-7803-2633-4
Type
conf
DOI
10.1109/ELECTR.1995.471033
Filename
471033
Link To Document