Co-fired ceramic on metal multichip modules for advanced military packaging

Author

Prabhu, A.N. ; Cherukuri, S.C. ; Thaler, B.J. ; Mindel, M.J.

Author_Institution

David Sarnoff Res. Center, Princeton, NJ, USA

fYear

1993

fDate

24-28 May 1993

Firstpage

217

Abstract

A novel, low temperature co-fired ceramic on metal (LTCC-M) multilayer circuit board technology intended for dual-use by both the military and commercial market sectors is described in this paper. This technology has been optimized for low cost, high circuit density multichip modules and board level integration. Limitations of the present low-temperature co-fired ceramic systems have been overcome by using a metal core in the LTCC-M technology. This technology readily allows the design of rugged, yet lightweight, electronic modules. In addition, the co-fired metal core permits this technology to be readily scaleable in terms of circuit density, size, and power dissipation; thereby making this an excellent candidate for a dual-use technology. Several advanced military packaging applications are pointed out in this paper

Keywords

military equipment; multichip modules; packaging; cofired ceramic on metal multichip modules; commercial market; dual-use technology; high circuit density; low cost; low-temperature; metal core; microwave packages; military packaging; multilayer circuit board; power dissipation; reliability; Assembly; Ceramics; Consumer electronics; Costs; Electronics packaging; Multichip modules; Nonhomogeneous media; Printed circuits; Temperature; Thermal conductivity;

fLanguage

English

Publisher

ieee

Conference_Titel

Aerospace and Electronics Conference, 1993. NAECON 1993., Proceedings of the IEEE 1993 National

Conference_Location

Dayton, OH

Print_ISBN

0-7803-1295-3

Type

conf

DOI

10.1109/NAECON.1993.290918

Filename

290918