FDTD modeling of 3D metal-LTCC structures for RF(MM)ICs

Author

Dong, X.T. ; Guo, B. ; Yin, W.Y. ; Gan, Y.B.

Author_Institution

Temasek Labs., Nat. Univ. of Singapore, Singapore

Volume

4

fYear

2003

fDate

22-27 June 2003

Firstpage

116

Abstract

Three-dimensional (3D) metal-low temperature co-fired ceramics (LTCCs) structures are studied using the finite-difference time-domain (FDTD) method. These types of materials have excellent high frequency performances for the design of multi-layer superstrate-substrate for various passive microwave devices. Numerical results are presented to show the effects of LTCC permittivity and loss on the reflection and transmission coefficients of microstrip discontinuities, including air-bridges and spiral inductors.

Keywords

MMIC; S-parameters; UHF integrated circuits; computational electromagnetics; dielectric losses; electromagnetic wave reflection; electromagnetic wave transmission; finite difference time-domain analysis; inductance; inductors; microstrip discontinuities; permittivity; substrates; 3D metal-LTCC structures; LTCC loss; LTCC permittivity; S-parameters; air-bridges; equivalent inductance; finite-difference time-domain method; full-wave numerical algorithm; high frequency performances; microstrip discontinuities; monolithic microwave integrated circuits; multilayer superstrate-substrate; radio frequency integrated circuits; reflection coefficients; spiral inductors; transmission coefficients; Ceramics; Finite difference methods; Frequency; Microstrip; Microwave devices; Permittivity; Propagation losses; Reflection; Temperature; Time domain analysis;

fLanguage

English

Publisher

ieee

Conference_Titel

Antennas and Propagation Society International Symposium, 2003. IEEE

Conference_Location

Columbus, OH, USA

Print_ISBN

0-7803-7846-6

Type

conf

DOI

10.1109/APS.2003.1220135

Filename

1220135