Finite element modeling for computer motherboard modal analysis

Computer is one of the most widely used electronics systems. During manufacturing, shipping, handing, and operation, it will be subjected to mechanical shocks and vibrations that may result in various failures. As a major component of a computer, motherboard has a considerable effect on the performance of a computer. Therefore, the prediction and improvement of the dynamic properties of the motherboard is of great significance. In this paper, the finite element modeling issues regarding the modal analysis of motherboard is addressed. The modeling approach is investigated extensively by means of computational and experimental modal analysis. A comparison of the modal parameters from both experiment and simulation shows the validity of the proposed approach. The effects of some model factors are also investigated.