• DocumentCode
    1852964
  • Title

    Low Power IC Design of the Wireless Monitoring System of the Orthopedic Implants

  • Author

    Hong Chen ; Ming Liu ; Chen Jia ; Chun Zhang ; Zhihua Wang

  • Author_Institution
    Tsinghua Univ., Beijing
  • fYear
    2007
  • fDate
    22-26 Aug. 2007
  • Firstpage
    5766
  • Lastpage
    5769
  • Abstract
    A low power IC of the wireless monitoring system of the orthopedic implants (WMSoOI) is put forth. The analog-digital mix-mode system monitors the implant duty cycle, detects abnormal asymmetry, wear, and high amounts of force, and other conditions of the orthopedic implants. Data for diagnosis is communicated wirelessly between the embedded chip (inside body) and the remote circuit (outside body). The radio frequency (RF) circuits have been taped out and tested. The power circuit is presented and verified by simulation. Future work includes the test of circuits of analog digital converter (ADC) and micro control unit (MCU) and the integrating of the entire system.
  • Keywords
    analogue-digital conversion; biomedical electronics; low-power electronics; microcontrollers; patient diagnosis; patient monitoring; prosthetics; abnormal asymmetry; analog digital converter; analog-digital mix-mode system; duty cycle; embedded chip; low power IC design; micro control unit; orthopedic implants; patient diagnosis; radio frequency circuits; wear; wireless monitoring system; Analog-digital conversion; Circuit simulation; Circuit testing; Control systems; Implants; Orthopedic surgery; Power integrated circuits; Radio frequency; Remote monitoring; System testing; Electric Power Supplies; Energy Transfer; Equipment Design; Equipment Failure Analysis; Humans; Miniaturization; Monitoring, Ambulatory; Orthopedic Equipment; Prostheses and Implants; Semiconductors; Signal Processing, Computer-Assisted; Telemetry;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society, 2007. EMBS 2007. 29th Annual International Conference of the IEEE
  • Conference_Location
    Lyon
  • ISSN
    1557-170X
  • Print_ISBN
    978-1-4244-0787-3
  • Type

    conf

  • DOI
    10.1109/IEMBS.2007.4353657
  • Filename
    4353657