Title :
On-chip interconnection design and SoC integration with OCP
Author :
Wang, Chih Wea ; Lai, Chi Shao ; Wu, Chi Feng ; Hwang, Shih Arn ; Lin, Ying Hsi
Author_Institution :
Realtek Semicond. Corp., Hsinchu
Abstract :
With the increasing complexity of modern system-on-chip (SoC) designs, more and more intellectual property (IP) blocks will be integrated into a chip. An open and flexible standard for IP core interface is quickly becoming necessary for efficient on-chip interconnection design and SoC integration. In this paper, we address the issues and share experiences on using Open Core Protocol (OCP) as the standard interface protocol, defining reusable profiles to fit different IPs, on-chip interconnection design, verification, and SoC integration with them.
Keywords :
industrial property; integrated circuit interconnections; system-on-chip; IP core interface; intellectual property; on-chip interconnection design; open core protocol; system-on-chip; Bridges; Collaborative work; Consumer electronics; Costs; Fabrics; Intellectual property; Protocols; Random access memory; Sockets; System-on-a-chip;
Conference_Titel :
VLSI Design, Automation and Test, 2008. VLSI-DAT 2008. IEEE International Symposium on
Conference_Location :
Hsinchu
Print_ISBN :
978-1-4244-1616-5
Electronic_ISBN :
978-1-4244-1617-2
DOI :
10.1109/VDAT.2008.4542404