DocumentCode
1853150
Title
On-chip interconnection design and SoC integration with OCP
Author
Wang, Chih Wea ; Lai, Chi Shao ; Wu, Chi Feng ; Hwang, Shih Arn ; Lin, Ying Hsi
Author_Institution
Realtek Semicond. Corp., Hsinchu
fYear
2008
fDate
23-25 April 2008
Firstpage
25
Lastpage
28
Abstract
With the increasing complexity of modern system-on-chip (SoC) designs, more and more intellectual property (IP) blocks will be integrated into a chip. An open and flexible standard for IP core interface is quickly becoming necessary for efficient on-chip interconnection design and SoC integration. In this paper, we address the issues and share experiences on using Open Core Protocol (OCP) as the standard interface protocol, defining reusable profiles to fit different IPs, on-chip interconnection design, verification, and SoC integration with them.
Keywords
industrial property; integrated circuit interconnections; system-on-chip; IP core interface; intellectual property; on-chip interconnection design; open core protocol; system-on-chip; Bridges; Collaborative work; Consumer electronics; Costs; Fabrics; Intellectual property; Protocols; Random access memory; Sockets; System-on-a-chip;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Design, Automation and Test, 2008. VLSI-DAT 2008. IEEE International Symposium on
Conference_Location
Hsinchu
Print_ISBN
978-1-4244-1616-5
Electronic_ISBN
978-1-4244-1617-2
Type
conf
DOI
10.1109/VDAT.2008.4542404
Filename
4542404
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