• DocumentCode
    1853150
  • Title

    On-chip interconnection design and SoC integration with OCP

  • Author

    Wang, Chih Wea ; Lai, Chi Shao ; Wu, Chi Feng ; Hwang, Shih Arn ; Lin, Ying Hsi

  • Author_Institution
    Realtek Semicond. Corp., Hsinchu
  • fYear
    2008
  • fDate
    23-25 April 2008
  • Firstpage
    25
  • Lastpage
    28
  • Abstract
    With the increasing complexity of modern system-on-chip (SoC) designs, more and more intellectual property (IP) blocks will be integrated into a chip. An open and flexible standard for IP core interface is quickly becoming necessary for efficient on-chip interconnection design and SoC integration. In this paper, we address the issues and share experiences on using Open Core Protocol (OCP) as the standard interface protocol, defining reusable profiles to fit different IPs, on-chip interconnection design, verification, and SoC integration with them.
  • Keywords
    industrial property; integrated circuit interconnections; system-on-chip; IP core interface; intellectual property; on-chip interconnection design; open core protocol; system-on-chip; Bridges; Collaborative work; Consumer electronics; Costs; Fabrics; Intellectual property; Protocols; Random access memory; Sockets; System-on-a-chip;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Design, Automation and Test, 2008. VLSI-DAT 2008. IEEE International Symposium on
  • Conference_Location
    Hsinchu
  • Print_ISBN
    978-1-4244-1616-5
  • Electronic_ISBN
    978-1-4244-1617-2
  • Type

    conf

  • DOI
    10.1109/VDAT.2008.4542404
  • Filename
    4542404