DocumentCode
1853384
Title
Development of highly-efficient machining method of double-layered micro channels for small mixer using end-milling and metal mold
Author
Tae-Jin Je ; Hwan-Jin Choi ; Doo-Sun Choi ; Eun-chae Jeon
Author_Institution
Div. of Nano-Mech. Syst., Korea Inst. of Machinery & Mater., Daejeon, South Korea
fYear
2013
fDate
July 30 2013-Aug. 2 2013
Firstpage
345
Lastpage
347
Abstract
Micro end-milling is a highly-efficient machining process and can be used to machine high hardness metal mold directly; therefore, it is applied to the machining of micro channel structures. There are conventional methods to fabricate the micro channels such as lithography, etching and laser processing; however, they have some demerits of high cost, limitation of materials and complex processes. Machining molds with micro channel structures for mixers using micro end-mills have been studied. According to recent study, ultra micro end-milling technology is required in order to improve the efficiency of mixers because the micro structures are double-layered channels. Tool breakage and micro burrs are issues due to diameter of the micro end-mill getting smaller. Machining characteristics using Φ 50 and 30 μm end-mill on 64 brass and STAVAX were studied in order to machine the micro complex channels. Tool stability and burrs were studied through analysis of the cutting force and cutting conditions. A micro-mixer mold with double-layered channel structures was machined.
Keywords
cutting; cutting tools; fracture; microfabrication; micromachining; micromechanical devices; milling; moulding; STAVAX; brass; cutting conditions; cutting force; double-layered microchannel fabrication; machining method efficiency; metal mold; micro end milling; microburrs; micromixer mold; tool breakage; tool stability; Feeds; Force; Lithography; Machining; Materials; Metals; Mixers; Cutting force; Metal mold; Micro end-mill; Micro-Mixer; Mixer; Tool breakage;
fLanguage
English
Publisher
ieee
Conference_Titel
Assembly and Manufacturing (ISAM), 2013 IEEE International Symposium on
Conference_Location
Xi´an
Print_ISBN
978-1-4799-1656-6
Type
conf
DOI
10.1109/ISAM.2013.6643475
Filename
6643475
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