A new routing design methodology for multi-chip IC packages

This paper presents a new methodology for routing design in multi-chip IC packages for reducing design time while attaining a layer efficiency comparable to hand crafted design. In the proposed methodology, a designer interactively develops a routable sketch of the design by means of "bendable-rats", using a tailored tool. Then the resultant routable sketch is converted to a curvilinear physical routing using a rubber-band algorithm. A design trial shows a 4.2 times design time reduction for an industrial design example.