DocumentCode
1853852
Title
Design and prototyping of a MEMS-based crackmeter for structural monitoring
Author
Ferri, M. ; Mancarella, F. ; Yan, J. ; Lee, J.E.-Y. ; Seshia, A.A. ; Zalesky, J. ; Soga, K. ; Roncaglia, A.
Author_Institution
Inst. of Microelectron. & Microsyst., CNR, Bologna, Italy
fYear
2009
fDate
21-25 June 2009
Firstpage
315
Lastpage
318
Abstract
Crack measurement is an important technique in structural monitoring, which is presently implemented with macroscopic devices characterized by rather demanding power consumption requirements. Such devices, consequently, are not very well suited for wireless operation, which is particularly interesting for specific applications involving deployment of a number of crackmeters within large-scale ageing infrastructures with possibility of remote, on-demand sensor interrogation. This paper reports about the research work related to the design and prototyping of a novel crackmeter suited for wireless structural monitoring realized with silicon MEMS strain sensors with high resolution, very low power operation and small size.
Keywords
condition monitoring; crack detection; low-power electronics; microsensors; strain sensors; structural engineering; MEMS-based crackmeter; large-scale ageing infrastructure; low-power operation; macroscopic devices; on-demand sensor interrogation; silicon strain sensor; wireless structural monitoring; Aging; Energy consumption; Large-scale systems; Micromechanical devices; Power measurement; Prototypes; Remote monitoring; Sensor phenomena and characterization; Silicon; Wireless sensor networks; Crack monitoring; MEMS; strain sensors; wireless;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009. International
Conference_Location
Denver, CO
Print_ISBN
978-1-4244-4190-7
Electronic_ISBN
978-1-4244-4193-8
Type
conf
DOI
10.1109/SENSOR.2009.5285501
Filename
5285501
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