DocumentCode :
1854133
Title :
Characterization of Au ring microelectrode with cyclic voltammetry and AC impedance spectroscopy
Author :
Weixuan Jing ; Fan Zhou ; Lujia Chen ; Zhuangde Jiang ; Lingling Niu ; Bing Wang ; Han Qi
Author_Institution :
State Key Lab. for Manuf. Syst. Eng., Xi´an Jiaotong Univ., Xi´an, China
fYear :
2013
fDate :
July 30 2013-Aug. 2 2013
Firstpage :
125
Lastpage :
127
Abstract :
In this paper Au ring microelectrodes are fabricated and characterized. With an optical fibre core as a substrate Au film with thickness 300nm was coated by an electron beam evaporation system, then on this Au coated substrate a parylene passivation layer was deposited, forming the desired Au ring microelectrode. Scanning electron microscopy (SEM) was used to characterize the quality of the deposited films and the adhesion at the interfaces. With a CHI660D electrochemical workstation the electrochemical characterizations were performed at room temperature in a conventional three-electrode system. Cyclic voltammograms as a function of scan rate were sigmoidal form, a typical electrochemical response of microelectrodes. AC impedance frequency spectrum of the fabricated Au ring microelectrode was also obtained in a reversible system, and good agreement was found with the Randels-type equivalent circuit.
Keywords :
adhesion; electrochemical impedance spectroscopy; gold; metallic thin films; microelectrodes; scanning electron microscopy; vacuum deposition; voltammetry (chemical analysis); AC impedance frequency spectrum; AC impedance spectroscopy; Au; CHI660D electrochemical workstation; SEM; adhesion; cyclic voltammetry; cyclic voltammograms; electron beam evaporation system; optical fibre core; parylene passivation layer; ring microelectrode; scanning electron microscopy; size 300 nm; temperature 293 K to 298 K; three-electrode system; Fasteners; Films; Fixtures; Gold; Impedance; Microelectrodes; AC impedance frequency spectrum; Cyclic voltammetry; Electron beam evaporation system; Scanning electron microscopy; Vacuum deposition system;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Assembly and Manufacturing (ISAM), 2013 IEEE International Symposium on
Conference_Location :
Xi´an
Print_ISBN :
978-1-4799-1656-6
Type :
conf
DOI :
10.1109/ISAM.2013.6643505
Filename :
6643505
Link To Document :
بازگشت