DocumentCode
1854183
Title
Influence of nano-SiO2 and BN on space charge and AC/DC performance of epoxy nanocomposites
Author
Dayuan Qiang ; Miao He ; Chen, George ; Andritsch, Thomas
Author_Institution
Tony Davis High Voltage Lab., Univ. of Southampton, Southampton, UK
fYear
2015
fDate
7-10 June 2015
Firstpage
492
Lastpage
495
Abstract
In this paper, the high purity bisphenol-A diglycidyl ether (DGEBA) epoxy resin (D.E.R 332), which is mainly used as filament winding, electrical laminates and encapsulation applications, was used as a host. The epoxy resins were loaded with nano-SiO2 and nano-BN in different loading concentrations, and then test of the AC/DC breakdown strength has been performed. It has been observed that the presence of untreated nano-fillers will decrease the AC/DC breakdown strength of nanocomposites. This may be caused by field enhancement resulting from agglomeration of un-treated nano-fillers. The influence of filler concentration and surface treatment, especially the filler type, of particles on AC, DC breakdown strength and space charge has been investigated. Moreover, it has been widely recognised that the presence of moisture in nanocomposites has detrimental effect on the electrical performance. Therefore, the water absorption of epoxy nanocomposites and its impact on electrical performance has also been considered.
Keywords
III-V semiconductors; boron compounds; electric breakdown; electric strength; encapsulation; filled polymers; laminates; moisture; nanocomposites; resins; silicon compounds; space charge; surface treatment; wide band gap semiconductors; AC-DC breakdown strength; BN; SiO2; electrical laminates; electrical performance; encapsulation applications; epoxy nanocomposites; field enhancement; filament winding; filler concentration; high purity bisphenol-A diglycidyl ether epoxy resin; loading concentrations; moisture; space charge; surface treatment; untreated nanofiller agglomeration; water absorption; Electric breakdown; Epoxy resins; Insulation; Loading; Nanocomposites; Space charge; Surface treatment; breakdown; epoxy resin; fillers; nanocomposites; space charge;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulation Conference (EIC), 2015 IEEE
Conference_Location
Seattle, WA
Print_ISBN
978-1-4799-7352-1
Type
conf
DOI
10.1109/ICACACT.2014.7223519
Filename
7223519
Link To Document