Title :
Optofluidic packaging of silicon microchips for applications in light emitting devices
Author :
Chung, S.E. ; Lee, S.A. ; Kim, J. ; Kwon, S.
Author_Institution :
Sch. of Electr. Eng. & Comput. Sci., Seoul Nat. Univ., Seoul, South Korea
Abstract :
We demonstrate optofluidic packaging of silicon microchips using image processing-based optofluidic maskless lithography (IP-OFML). Optofluidic maskless lithography (OFML) is a dynamic photopolymerization technique for free-floating microstructures within a fluidic channel using a MEMS spatial light modulator. OFML via computer vision-aided image processing enables individual polymer packaging of each microdevice for protection. Furthermore, our technology is applicable to phosphor coating of light emitting diodes (LEDs).
Keywords :
computer vision; fluidics; light emitting diodes; lithography; micromechanical devices; microprocessor chips; packaging; phosphors; polymerisation; spatial light modulators; MEMS spatial light modulator; computer vision; dynamic photopolymerization; fluidic channel; image processing; light emitting diodes; optofluidic maskless lithography; optofluidic packaging; phosphor coating; polymer packaging; silicon microchips; Application software; Fluid dynamics; Fluidic microsystems; Light emitting diodes; Lithography; Microfluidics; Micromechanical devices; Microstructure; Packaging; Silicon; Light emitting diodes; Packaging; Phosphor;
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009. International
Conference_Location :
Denver, CO
Print_ISBN :
978-1-4244-4190-7
Electronic_ISBN :
978-1-4244-4193-8
DOI :
10.1109/SENSOR.2009.5285518
