DocumentCode :
1854423
Title :
Micromolding methods for hollow microneedle arrays using megasonically enhanced casting
Author :
Khumpuang, S. ; Ruther, P. ; Paul, O.
Author_Institution :
Dept. of Microsyst. Eng. (IMTEK), Univ. of Freiburg, Freiburg, Germany
fYear :
2009
fDate :
21-25 June 2009
Firstpage :
220
Lastpage :
223
Abstract :
This paper presents novel methods to fill complex micromold inserts for both positive and negative structures, i.e. high-aspect-ratio micropillar and deep slender cavities. Megasonic agitation is applied during polymer casting into the mold inserts. The replication is successfully demonstrated with hollow microneedle arrays. The mold inserts are fabricated using a combination of anisotropic wet etching and deep reactive ion etching (DRIE) of silicon. The mold features to form microchannels either are realized using SU-8 lithography on silicon cavities or apply a two-part insert with silicon comb structures. Needles realized with this method are 250 mum in length with a side-length of 200 mum and comprise channels with cross-sectional areas of 40times40 mum2.
Keywords :
casting; lithography; micromechanical devices; moulding; silicon; sputter etching; SU-8 lithography; Si; anisotropic wet etching; deep reactive ion etching; hollow microneedle arrays; megasonically enhanced casting; microchannels; micromolding methods; replication; silicon cavity; silicon comb structures; size 200 mum; size 250 mum; Casting; Embossing; Filling; Fingers; Injection molding; Lithography; Microstructure; Polymers; Silicon; Wet etching; Microneedles; high-aspect-ratio microstructures; megasonic agitation; micromold;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009. International
Conference_Location :
Denver, CO
Print_ISBN :
978-1-4244-4190-7
Electronic_ISBN :
978-1-4244-4193-8
Type :
conf
DOI :
10.1109/SENSOR.2009.5285525
Filename :
5285525
Link To Document :
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