DocumentCode :
1854441
Title :
Vertically interconnected thin substrate broadband slotted spiral antenna for conformal phased arrays
Author :
Bosui Liu ; Ferendeci, A.M.
Author_Institution :
Dept. of ECECS, Cincinnati Univ., OH, USA
Volume :
4
fYear :
2003
fDate :
22-27 June 2003
Firstpage :
478
Abstract :
A new broadband 2-arm Archimedean slotted spiral antenna was designed and monolithically fabricated as an integral part of a 3D MMIC (Multilayer Microwave Integrated Circuit) T/R module. The antenna was processed on a thin polyimide substrate (68 um thick, 0.0038 /spl lambda/g) with a bottom ground plane. A wideband stripline balun was vertically interconnected to the antenna. Return loss of less than -10 dB was measured from 6 to 14 GHz with a lowest value of -49 dB at 10.8 GHz. Uniform broadside radiation pattern was obtained across the X-band with a gain variation of -12 /spl sim/ -1 dB. Both simulation and measurement results showed that performance of the slotted spiral antenna on a thin substrate was improved when the slot width became comparable to the polyimide substrate thickness. Also, reactive near field power distribution was measured for PCB slotted spiral antennas with similar designs. The low profile of the 3D MMIC T/R module enables the realization of the conformal phased array antenna systems.
Keywords :
MMIC; antenna phased arrays; antenna radiation patterns; baluns; broadband antennas; conformal antennas; slot antenna arrays; spiral antennas; 3D MMIC T/R module; 6 to 14 GHz; Archimedean slotted spiral antenna; X-band; broadband antenna; conformal phased arrays; reactive near field power distribution; thin polyimide substrate; uniform broadside radiation pattern; vertically interconnected thin substrate; wideband stripline balun; Antenna arrays; Antenna measurements; Broadband antennas; Integrated circuit interconnections; MMICs; Microwave antennas; Phased arrays; Polyimides; Slot antennas; Spirals;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Antennas and Propagation Society International Symposium, 2003. IEEE
Conference_Location :
Columbus, OH, USA
Print_ISBN :
0-7803-7846-6
Type :
conf
DOI :
10.1109/APS.2003.1220314
Filename :
1220314
Link To Document :
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