DNA assembly of component arrays for nanoscale electronics

Author

Kieh, Richard A. ; Le, John D. ; Musier-Forsyth, Karin ; Pinto, Yariv Y. ; Seeman, Nadrian C. ; Taton, T. Andrew

Author_Institution

Dept. of Electr. & Comput. Eng., Minnesota Univ., Minneapolis, MN, USA

fYear

2005

fDate

11-15 July 2005

Firstpage

738

Abstract

A method for assembling arrays of components in programmable 2D arrangements with nanometer-scale precision is needed for the manufacture of high density nanoelectronic circuitry. We discuss the programmed self-assembly based on in situ hybridization of DNA-functionalized components to a pre-assembled 2D DNA scaffolding on a surface. We show that arrays of prototype electronic components composed of Au nanoparticles and nanowires can be assembled on a surface with high precision. This approach is broadly applicable to the manufacture of nanoscale integrated circuits for logic, memory, sensing, and other applications.

Keywords

DNA; assembling; integrated circuit manufacture; nanoelectronics; nanoparticles; nanowires; precision engineering; 2D DNA scaffolding; DNA assembly; DNA-functionalized components; high density nanoelectronic circuitry; in situ hybridization; nanometer-scale precision; nanoparticles; nanoscale electronics; nanoscale integrated circuits; nanowires; programmable 2D arrangements; programmed self-assembly; Assembly; Circuits; DNA; Electronic components; Gold; Manufacturing; Nanoparticles; Nanowires; Prototypes; Self-assembly;

fLanguage

English

Publisher

ieee

Conference_Titel

Nanotechnology, 2005. 5th IEEE Conference on

Print_ISBN

0-7803-9199-3

Type

conf

DOI

10.1109/NANO.2005.1500636

Filename

1500636