Title :
Strength evaluation of lead-free-solder joint fabricated by reactive film local heating
Author :
Ootani, K. ; Yamano, Y. ; Namazu, T. ; Inoue, S.
Author_Institution :
Dept. of Mech. & Syst. Eng., Univ. of Hyogo, Kobe, Japan
Abstract :
This paper focuses on evaluating the adhesive strength of silver-tin (Ag-Sn) solder-jointed single-crystal silicon (SCS) specimens. The exothermic reaction in aluminum-nickel (Al/Ni) multilayer film was used as a heat source for melting the solder film. The reaction generated heat enough to melt Ag-Sn film. To measure the adhesive strength of solder-jointed SCS specimens, we developed the four-point bending tester for minute specimens. The rectangular-solid SCS specimens having an Ag-Sn/AlNi/Ag-Sn section were prepared by dicing the bonded SCS wafer under various pressure loads in air and vacuum. As a result, fracture strength increased with an increase of pressure load. The strength of specimens bonded in vacuum was higher than that bonded in air.
Keywords :
adhesives; air; fracture toughness; heat treatment; melting; metallic thin films; multilayers; silver; solders; tin; Ag-Sn; adhesive strength; air; aluminum-nickel multilayer film; dicing; exothermic reaction; fracture strength; heat source; lead-free-solder joint; melting; pressure load; reactive film local heating; silver-tin solder-jointed single-crystal silicon specimens; vacuum; Adhesive strength; Atomic layer deposition; Force measurement; Lead; Micromechanical devices; Nonhomogeneous media; Packaging; Soldering; Testing; Wafer bonding; Ag-Sn solder film; Al/Ni multilayer film; Bending test; Exothermic reaction; MEMS package; Strength;
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009. International
Conference_Location :
Denver, CO
Print_ISBN :
978-1-4244-4190-7
Electronic_ISBN :
978-1-4244-4193-8
DOI :
10.1109/SENSOR.2009.5285537
