Title :
Table of contents
Abstract :
The following topics are dealt with: analog circuits; test & design for test; sensors; nanoelectronics; digital VLSI; advanced packaging; signal integrity; 3D technologies; ADC; memory readout; 3D design solutions; advanced device topics; thermal integrity and process technologies.
Keywords :
VLSI; analogue circuits; analogue-digital conversion; design for testability; digital integrated circuits; electronics packaging; nanoelectronics; sensors; three-dimensional integrated circuits; 3D design solutions; 3D technologies; ADC; analog circuits; design for test; digital VLSI; memory readout; nanoelectronics; packaging; process technologies; sensors; signal integrity; thermal integrity;
Conference_Titel :
Quality Electronic Design (ASQED), 2013 5th Asia Symposium on
Conference_Location :
Penang
Print_ISBN :
978-1-4799-1312-1
DOI :
10.1109/ASQED.2013.6643552
