DocumentCode
1855282
Title
IDDQ trending as a precursor to semiconductor failure
Author
Zhang, Guangfan ; Das, Diganta ; Xu, Roger ; Pecht, Michael
Author_Institution
Intell. Autom., Inc., Rockville, MD
fYear
2008
fDate
6-9 Oct. 2008
Firstpage
1
Lastpage
7
Abstract
Airborne electronic systems have been used virtually everywhere on board military and commercial aircraft. Since Field Effect Transistors (FETs) are building blocks for the electronic systems and their components, the diagnosis and prognosis of potential FET system failures are critical to the flight and ground crew. In this paper, we developed an advanced prognostic methodology based on the Direct Drain Quiescent Current (IDDQ) testing technique for potential Field Effect Transistors (FETs) failures. To predict the Remaining useful life (RUL) of the FET-based devices, a thorough failure mechanism study for FETs was performed in order to select a subset of failure mechanisms that cause progressive degradation and relate with IDDQ signals. With the selected failure mechanisms, we utilized the symbolic dynamics-based method to perform the fault degradation status estimation and a novel Uncertainty Adjusted Prognostics (UAP) method to predict the RUL with uncertainty management. Finally, the prognostic methodology was verified using developed 2-D/3-D simulation models.
Keywords
avionics; field effect transistors; semiconductor device models; semiconductor device reliability; semiconductor device testing; 2-D/3-D simulation models; FET system failures; airborne electronic systems; direct drain quiescent current testing; field effect transistors; remaining useful life; uncertainty adjusted prognostics; Circuit testing; Degradation; FETs; Failure analysis; Leakage current; MOSFET circuits; Military aircraft; Packaging; Safety; Uncertainty; Direct Drain Quiescent Current; Field Effect Transistors; Prognostics; Remaining Useful Life;
fLanguage
English
Publisher
ieee
Conference_Titel
Prognostics and Health Management, 2008. PHM 2008. International Conference on
Conference_Location
Denver, CO
Print_ISBN
978-1-4244-1935-7
Electronic_ISBN
978-1-4244-1936-4
Type
conf
DOI
10.1109/PHM.2008.4711419
Filename
4711419
Link To Document