Title :
DNA networks as templates for bottom-up assembly of metal nanowires
Author :
Lund, John ; Dong, Jianchun ; Deng, Zhaoxiang ; Mao, Chengde ; Parviz, Babak
Author_Institution :
Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
Abstract :
This paper outlines a method for the fabrication of metal nanowires using ordered DNA networks as a template. The paper also includes a verification of the functionality of these nanowires. Strands of λ-DNA were aligned on a mica surface and coated with palladium via electroless deposition. Electrical contacts were then formed on the surface using thermal evaporation through a mesh of thin wires. Conductivity between adjacent pads was measured and compared to AFM images of the wires between the pads to determine their electrical properties.
Keywords :
DNA; electrical conductivity; electrical contacts; nanotechnology; nanowires; palladium; self-assembly; DNA networks; Pd; bottom-up assembly; conductivity; electrical contacts; electrical properties; electroless deposition; metal nanowires; mica surface; palladium; thermal evaporation; Assembly; DNA; Fabrication; Insulation; Nanobioscience; Nanoscale devices; Nanowires; Palladium; Self-assembly; Wires;
Conference_Titel :
Nanotechnology, 2005. 5th IEEE Conference on
Print_ISBN :
0-7803-9199-3
DOI :
10.1109/NANO.2005.1500663