• DocumentCode
    1855325
  • Title

    DNA networks as templates for bottom-up assembly of metal nanowires

  • Author

    Lund, John ; Dong, Jianchun ; Deng, Zhaoxiang ; Mao, Chengde ; Parviz, Babak

  • Author_Institution
    Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
  • fYear
    2005
  • fDate
    11-15 July 2005
  • Firstpage
    836
  • Abstract
    This paper outlines a method for the fabrication of metal nanowires using ordered DNA networks as a template. The paper also includes a verification of the functionality of these nanowires. Strands of λ-DNA were aligned on a mica surface and coated with palladium via electroless deposition. Electrical contacts were then formed on the surface using thermal evaporation through a mesh of thin wires. Conductivity between adjacent pads was measured and compared to AFM images of the wires between the pads to determine their electrical properties.
  • Keywords
    DNA; electrical conductivity; electrical contacts; nanotechnology; nanowires; palladium; self-assembly; DNA networks; Pd; bottom-up assembly; conductivity; electrical contacts; electrical properties; electroless deposition; metal nanowires; mica surface; palladium; thermal evaporation; Assembly; DNA; Fabrication; Insulation; Nanobioscience; Nanoscale devices; Nanowires; Palladium; Self-assembly; Wires;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nanotechnology, 2005. 5th IEEE Conference on
  • Print_ISBN
    0-7803-9199-3
  • Type

    conf

  • DOI
    10.1109/NANO.2005.1500663
  • Filename
    1500663