DocumentCode :
1855425
Title :
Application-dependent scaling tradeoffs and optimization in the SoC era
Author :
Diaz, Carlos H. ; Chang, Mi-Chang ; Ong, T.C. ; Sun, Jack
Author_Institution :
Taiwan Semicond. Manuf. Co., Taiwan
fYear :
2002
fDate :
2002
Firstpage :
475
Lastpage :
478
Abstract :
Several physical phenomena in highly scaled CMOS technology have now become first order elements affecting electrical behavior of transistor characteristics. Effects such as STI mechanical stress, direct tunneling in gate dielectrics, gate line-edge roughness, and others, have significant influence on device characteristics. This paper elaborates on these effects to exemplify the need for closer interaction between circuit design and process development teams in order to push out application-dependent scaling limits. The paper also highlights the need for further efforts in the areas of circuit-level device modeling.
Keywords :
CMOS integrated circuits; circuit optimisation; integrated circuit design; integrated circuit modelling; integrated circuit reliability; system-on-chip; ASIC; STI mechanical stress; SoC; application-dependent scaling optimization; application-dependent scaling tradeoffs; circuit-level device modeling; direct tunneling; electrical behavior; first order elements; gate dielectrics; gate line-edge roughness; highly scaled CMOS technology; long term reliability; transistor characteristics; CMOS technology; Circuit synthesis; Circuit testing; Dielectric devices; Gate leakage; Isolation technology; Libraries; SPICE; Stress; Tunneling;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Custom Integrated Circuits Conference, 2002. Proceedings of the IEEE 2002
Print_ISBN :
0-7803-7250-6
Type :
conf
DOI :
10.1109/CICC.2002.1012880
Filename :
1012880
Link To Document :
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