DocumentCode :
1855555
Title :
CFD analysis of the thermal interruption process of gases with low environmental impact in high voltage circuit breakers
Author :
Ye, X. ; Dhotre, M.T. ; Mantilla, J.D. ; Kotilainen, S.
Author_Institution :
ABB Switzerland Ltd., Baden, Switzerland
fYear :
2015
fDate :
7-10 June 2015
Firstpage :
375
Lastpage :
378
Abstract :
Gases and gas mixtures with lower environmental impact are being investigated as possible alternatives to SF6 as the switching medium in high voltage circuit breakers. One of the most important aspects of the investigation is the thermal interruption characteristic which depends on flow acceleration, and efficient cooling of the arc around current zero. In the present work, the influence of the gas properties on the thermal interruption capability is investigated using Computational Fluid Dynamics (CFD). A gas mixture of fluroketones with CO2 as background gas is considered. The underlying thermal interruptions behavior of this gas mixture is compared with that of SF6. The individual influence of the axial flow parameters namely pressure, velocity, Mach number and density on thermal interruption is studied. A thermal interruption proxy parameter is derived by combining the axial flow variables, which can better characterize the thermal interruption. The differences between the different gases using this proxy are presented. The design parameters influencing the pressure build-up and thermal interruption behavior are investigated and discussed.
Keywords :
Mach number; SF6 insulation; circuit breakers; computational fluid dynamics; gas mixtures; gases; CFD analysis; Mach number; SF6; computational fluid dynamics; flow acceleration; fluroketones gas mixture; gas mixtures; gases; high voltage circuit breakers; thermal interruption characteristic; thermal interruption process; thermal interruption proxy parameter; Gases; CFD; Fluoroketones; flow; high voltage circuit breaker; thermal interruption;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulation Conference (EIC), 2015 IEEE
Conference_Location :
Seattle, WA
Print_ISBN :
978-1-4799-7352-1
Type :
conf
DOI :
10.1109/ICACACT.2014.7223581
Filename :
7223581
Link To Document :
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