Title :
Wafer level packaging of MEMS
Author_Institution :
Tohoku Univ., Sendai, Japan
Abstract :
Wafer level packaging methods of MEMS are described. These play important roles to reduce cost and to improve reliability. MEMS structures on silicon chips are encapsulated with bonded caps or with shells fabricated by surface micromachining, and electrical interconnections are made from the cavity. Vacuum packaging methods are also described.
Keywords :
integrated circuit interconnections; integrated circuit reliability; micromachining; micromechanical devices; wafer level packaging; MEMS; circuit reliability; electrical interconnection; silicon chip; surface micromachining; vacuum packaging method; wafer level packaging method; Capacitive sensors; Circuits; Costs; Etching; Glass; Micromechanical devices; Packaging machines; Silicon; Wafer bonding; Wafer scale integration; MEMS; Wafer level packaging; bonding;
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009. International
Conference_Location :
Denver, CO
Print_ISBN :
978-1-4244-4190-7
Electronic_ISBN :
978-1-4244-4193-8
DOI :
10.1109/SENSOR.2009.5285574
