• DocumentCode
    1855721
  • Title

    Interdigitated front contact solar cells fabricated by CMOS process technologies

  • Author

    Choi, Youngmoon ; Kim, Deok-kee ; Do, Eun Cheol ; Mun, Jinsoo ; Lee, Jin Wook ; Baik, Ihngee ; Kim, Dongkyun ; Kim, Yun Gi

  • Author_Institution
    Energy Lab., Samsung Adv. Inst. of Technol., Yongin, South Korea
  • fYear
    2011
  • fDate
    19-24 June 2011
  • Abstract
    We have fabricated novel interdigitated front contact structure silicon solar cells by using CMOS process technologies. Shallow emitter junction process using ion implantations and low leakage front contact process using barrier metals were developed. Front local base contact employed self-aligned spacer isolation technologies between emitter and base contacts. And we adjusted these with fine-pattern interdigitated grids to increase energy conversion efficiency. Inverted pyramid texturing, double anti-reflection coating, and trapezoidal metal etch technologies were integrated to increase photo-generated currents. Advanced module fabrication was developed for our cell structure. Integrating these new technologies, we have recorded maximum module efficiency of 20.1% in our laboratory.
  • Keywords
    CMOS integrated circuits; coating techniques; etching; ion implantation; solar cells; CMOS process technologies; advanced module fabrication; barrier metals; double-antireflection coating; efficiency 20.1 percent; emitter contact; energy conversion efficiency; fine-pattern interdigitated grids; front-local-base contact; interdigitated front-contact solar cells; inverted pyramid texturing; ion implantations; low-leakage front-contact process; module efficiency; photo-generated currents; self-aligned spacer isolation technologies; shallow-emitter junction process; trapezoidal metal etch technology; Contacts; Junctions; Metals; Photovoltaic cells; Shape; Silicon; Surface treatment;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photovoltaic Specialists Conference (PVSC), 2011 37th IEEE
  • Conference_Location
    Seattle, WA
  • ISSN
    0160-8371
  • Print_ISBN
    978-1-4244-9966-3
  • Type

    conf

  • DOI
    10.1109/PVSC.2011.6185947
  • Filename
    6185947