DocumentCode
1855835
Title
Full system power delivery analysis for single ended interface
Author
Heng Chuan Shu ; Bok Eng Cheah ; Kong, Jackson ; Sze Geat Pang ; Li Chuang Quek
Author_Institution
Intel Microelectron. (M) Sdn. Bhd, Bayan Lepas, Malaysia
fYear
2013
fDate
26-28 Aug. 2013
Firstpage
144
Lastpage
147
Abstract
The conventional power delivery analysis applying Icc(t) approach has the propensity to yield pessimistic outcome that leads to power delivery network (PDN) over-design. In addition, the noise profile captured using Icc(t) approach has high prospect of miscorrelation with the lab measurement data. Recent works adopting the signal integrity and power delivery (SIPD) co-simulation approach was found fruitful to produce better results compare to the conventional Icc(t) approach. However, the SIPD co-simulation approach is still unable to address the miscorrelation between the simulation and validation results based on time domain analysis. In this paper, the limitations of the Icc(t) based methodology and several important simulation assumptions that are critical to further improve the simulation accuracy are discussed. Key parameters that pose significant impacts to power delivery noise behavior are characterized through this evaluation. The impact of the power delivery noise to overall signaling perfomance is also discussed in this paper for future design references.
Keywords
circuit simulation; integrated circuit noise; power integrated circuits; time-domain analysis; Icc(t) approach; Icc(t) based methodology; PDN; SIPD cosimulation approach; full system power delivery analysis; lab measurement data; miscorrelation; noise profile; power delivery network; power delivery noise behavior; signal integrity and power delivery cosimulation approach; signaling perfomance; single ended interface; time domain analysis; Analytical models; Data models; Impedance; Load modeling; Noise; Switches; Transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
Quality Electronic Design (ASQED), 2013 5th Asia Symposium on
Conference_Location
Penang
Print_ISBN
978-1-4799-1312-1
Type
conf
DOI
10.1109/ASQED.2013.6643577
Filename
6643577
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