DocumentCode
1856302
Title
Fabrication and dielectric properties of highly loaded polypropylene micro- and nano-composites
Author
Couderc, H. ; Vanga, C. ; Frechette, M. ; David, E.
Author_Institution
Hydro-Quebec´s Res. Inst., Varennes, QC, Canada
fYear
2015
fDate
7-10 June 2015
Firstpage
238
Lastpage
242
Abstract
Nanoparticles and microparticles of hexagonal boron nitride (hBN) were added to polypropylene (PP) powder to produce 50 wt% nano and microcomposites by planetary milling. A nanostructured microcomposite containing 25 wt% of microparticles and 25 wt% of nanoparticles was also prepared to ally the improved properties of micro and nanocomposites. Thermo Gravimetric Analyses were conducted to ensure that there was no contamination during fabrication. Results show that the breakdown strength is increased by about 20% with addition of nano hBN when compared to that of neat PP. On the contrary, the microcomposite sample shows a poor dispersion and lower breakdown strength, observations being likely associated to an inhomogeneous sample. Dielectric Spectroscopy shows that the hydrophily of boron nitride leads to an increases water uptake in the samples, and so, an increase of the conductivity phenomenon.
Keywords
boron compounds; ceramics; differential scanning calorimetry; electric breakdown; electrical conductivity; filled polymers; microfabrication; nanocomposites; nanofabrication; nanoparticles; BN; breakdown strength; conductivity phenomenon; dielectric properties; dielectric spectroscopy; hexagonal boron nitride; highly loaded polypropylene microcomposites; highly loaded polypropylene nanocomposites; microparticles; nanoparticles; nanostructured microcomposite; planetary milling; polypropylene powder; thermogravimetric analysis; Boron; Extraterrestrial measurements; Heating; Matrix decomposition; Nitrogen; Nonhomogeneous media; Pollution measurement; Nanocomposites; dielectric breakdown; dielectric spectroscopy; planetary milling; thermo gravimetric analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulation Conference (EIC), 2015 IEEE
Conference_Location
Seattle, WA
Print_ISBN
978-1-4799-7352-1
Type
conf
DOI
10.1109/ICACACT.2014.7223614
Filename
7223614
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