• DocumentCode
    1856302
  • Title

    Fabrication and dielectric properties of highly loaded polypropylene micro- and nano-composites

  • Author

    Couderc, H. ; Vanga, C. ; Frechette, M. ; David, E.

  • Author_Institution
    Hydro-Quebec´s Res. Inst., Varennes, QC, Canada
  • fYear
    2015
  • fDate
    7-10 June 2015
  • Firstpage
    238
  • Lastpage
    242
  • Abstract
    Nanoparticles and microparticles of hexagonal boron nitride (hBN) were added to polypropylene (PP) powder to produce 50 wt% nano and microcomposites by planetary milling. A nanostructured microcomposite containing 25 wt% of microparticles and 25 wt% of nanoparticles was also prepared to ally the improved properties of micro and nanocomposites. Thermo Gravimetric Analyses were conducted to ensure that there was no contamination during fabrication. Results show that the breakdown strength is increased by about 20% with addition of nano hBN when compared to that of neat PP. On the contrary, the microcomposite sample shows a poor dispersion and lower breakdown strength, observations being likely associated to an inhomogeneous sample. Dielectric Spectroscopy shows that the hydrophily of boron nitride leads to an increases water uptake in the samples, and so, an increase of the conductivity phenomenon.
  • Keywords
    boron compounds; ceramics; differential scanning calorimetry; electric breakdown; electrical conductivity; filled polymers; microfabrication; nanocomposites; nanofabrication; nanoparticles; BN; breakdown strength; conductivity phenomenon; dielectric properties; dielectric spectroscopy; hexagonal boron nitride; highly loaded polypropylene microcomposites; highly loaded polypropylene nanocomposites; microparticles; nanoparticles; nanostructured microcomposite; planetary milling; polypropylene powder; thermogravimetric analysis; Boron; Extraterrestrial measurements; Heating; Matrix decomposition; Nitrogen; Nonhomogeneous media; Pollution measurement; Nanocomposites; dielectric breakdown; dielectric spectroscopy; planetary milling; thermo gravimetric analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation Conference (EIC), 2015 IEEE
  • Conference_Location
    Seattle, WA
  • Print_ISBN
    978-1-4799-7352-1
  • Type

    conf

  • DOI
    10.1109/ICACACT.2014.7223614
  • Filename
    7223614