Title :
Three dimensional surface-shape tactile imager with fingertip-size silicon integrated sensor-membran
Author :
Takao, Hidekuni ; Yawata, Masaki ; Sawada, Kazuaki ; Ishida, Makoto ; Okada, Hiroki
Author_Institution :
Dept. of Electr. & Electron. Eng., Toyohashi Univ. of Technol., Toyohashi, Japan
Abstract :
In this study, fingertip-size integrated silicon tactile sensor-membrane for three-dimensional (3D) surface-shape imaging system has been newly developed. The sensing area is 8 mmphi-area and several-mum thickness silicon membrane. It is swollen like a balloon surface and strain sensor pixel is arrayed on it for detection of surface shape. The movable device structure is fabricated by CMOS compatible post micromachining with SOI wafers. Totally integrated device packaging technology was also developed for surface-shape imaging system. Experimental demonstration of real-time imaging/reading of 3D Braille surface´ is presented for the first time. In this system, nearly 1 mum depth resolution is realized at 1Hz-bandwidth by highly sensitive silicon sensor structure with enough robustness in use.
Keywords :
CMOS integrated circuits; image sensors; microfabrication; microsensors; silicon-on-insulator; tactile sensors; CMOS compatible post micromachining; SOI wafers; balloon surface; fingertip-size integrated silicon tactile sensor-membrane; integrated device packaging technology; movable device structure; silicon sensor structure; strain sensor pixel; surface shape detection; surface-shape imaging system; three dimensional surface-shape tactile imager; three-dimensional surface-shape imaging system; Biomembranes; CMOS image sensors; CMOS technology; Capacitive sensors; High-resolution imaging; Micromachining; Packaging; Sensor arrays; Shape; Silicon; CMOS/MEMS; Fingertip-size; Integrated sensor; Surface shape imaging; Tactile sensor;
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009. International
Conference_Location :
Denver, CO
Print_ISBN :
978-1-4244-4190-7
Electronic_ISBN :
978-1-4244-4193-8
DOI :
10.1109/SENSOR.2009.5285610
