• DocumentCode
    1856933
  • Title

    Evaluation of Entropy Driven Compression Bounds on Industrial Designs

  • Author

    Alampally, Srinivasulu ; Abraham, Jais ; Parekhji, Rubin A. ; Kapur, Rohit ; Williams, T.W.

  • Author_Institution
    Texas Instrum., Bangalore
  • fYear
    2008
  • fDate
    24-27 Nov. 2008
  • Firstpage
    13
  • Lastpage
    18
  • Abstract
    The use of scan based compression techniques is becoming mandatory on current designs. While high compression is desired to hold the test costs within limits, it is important to understand the bounds set by the entropy of the care bits required by different compression techniques, to enable the selection of the right set of design and test parameters. This paper highlights the available solution space for compression based designs and discusses the various parameters which result in test tradeoffs. The discussion is supported with elaborate experimental data. Through them, the paper offers an insight into the solution space of compression techniques and makes resulting recommendations.
  • Keywords
    combinational circuits; design for testability; integrated circuit testing; logic testing; sequential circuits; system-on-chip; SoC; combinational compression; compression based design; design-for-scan compression; entropy evaluation; industrial design; scan based compression technique; sequential compression; test cost; test parameters; Automatic test pattern generation; Built-in self-test; Costs; Encoding; Entropy; Fault detection; Flip-flops; Instruments; Testing; Scan compression; combinational and sequential compression; compression bounds; design for scan compression; entropy;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Asian Test Symposium, 2008. ATS '08. 17th
  • Conference_Location
    Sapporo
  • ISSN
    1081-7735
  • Print_ISBN
    978-0-7695-3396-4
  • Type

    conf

  • DOI
    10.1109/ATS.2008.89
  • Filename
    4711553