DocumentCode
1856933
Title
Evaluation of Entropy Driven Compression Bounds on Industrial Designs
Author
Alampally, Srinivasulu ; Abraham, Jais ; Parekhji, Rubin A. ; Kapur, Rohit ; Williams, T.W.
Author_Institution
Texas Instrum., Bangalore
fYear
2008
fDate
24-27 Nov. 2008
Firstpage
13
Lastpage
18
Abstract
The use of scan based compression techniques is becoming mandatory on current designs. While high compression is desired to hold the test costs within limits, it is important to understand the bounds set by the entropy of the care bits required by different compression techniques, to enable the selection of the right set of design and test parameters. This paper highlights the available solution space for compression based designs and discusses the various parameters which result in test tradeoffs. The discussion is supported with elaborate experimental data. Through them, the paper offers an insight into the solution space of compression techniques and makes resulting recommendations.
Keywords
combinational circuits; design for testability; integrated circuit testing; logic testing; sequential circuits; system-on-chip; SoC; combinational compression; compression based design; design-for-scan compression; entropy evaluation; industrial design; scan based compression technique; sequential compression; test cost; test parameters; Automatic test pattern generation; Built-in self-test; Costs; Encoding; Entropy; Fault detection; Flip-flops; Instruments; Testing; Scan compression; combinational and sequential compression; compression bounds; design for scan compression; entropy;
fLanguage
English
Publisher
ieee
Conference_Titel
Asian Test Symposium, 2008. ATS '08. 17th
Conference_Location
Sapporo
ISSN
1081-7735
Print_ISBN
978-0-7695-3396-4
Type
conf
DOI
10.1109/ATS.2008.89
Filename
4711553
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