DocumentCode
1857315
Title
Novel oxygen showering process (OSP) for extreme damage suppression of sub-20nm high density p-MTJ array without IBE treatment
Author
Jeong, J.H. ; Endoh, T.
Author_Institution
Grad. Sch. of Eng., Tohoku Univ., Sendai, Japan
fYear
2015
fDate
16-18 June 2015
Abstract
A novel damage recovery scheme using the oxygen showering post-treatment (OSP) is proposed to recover patterning damages and to improve electric and magnetic properties of p-MTJs, and its array yield. By applying our OSP to 25nm p-MTJs cell array, the MR was increased from 99% to 116% and the Isw was decreased from 41.1uA to 28.7uA. Moreover, electric short fails of MTJs array due to metallic by-products reduced dramatically by the selective oxidation of the damaged layer and its isolation from damage-less area. The OSP process makes the switching efficiency of 25nm patterned MTJs to be improved more than 30% compared with IBE treatment process. The mechanism of this enhancement is that spin directions of damaged area is changed from perpendicular to in-plane and, by this change, the energy barrier of damaged area is reduced. By the OSP treatment, we could develop the robust patterning process for sub-20nm STT-MRAM.
Keywords
MRAM devices; electric properties; magnetic tunnelling; magnetoelectronics; semiconductor technology; IBE treatment process; OSP process; STT-MRAM; current 28.7 muA; current 41.1 muA; damage recovery scheme; electric properties; extreme damage suppression; high density p-MTJ array; magnetic properties; magnetic tunnel junction; oxygen showering posttreatment; oxygen showering process; patterning damages; size 20 nm; size 25 nm; spin transfer torque; Arrays; Magnetic properties; Magnetic tunneling; Market research; Oxidation; Switches; Thermal stability; Damage recovery; MRAM; MTJs; selective oxidation; short yield; switching efficiency;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Technology (VLSI Technology), 2015 Symposium on
Conference_Location
Kyoto
ISSN
0743-1562
Type
conf
DOI
10.1109/VLSIT.2015.7223660
Filename
7223660
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