• DocumentCode
    1857315
  • Title

    Novel oxygen showering process (OSP) for extreme damage suppression of sub-20nm high density p-MTJ array without IBE treatment

  • Author

    Jeong, J.H. ; Endoh, T.

  • Author_Institution
    Grad. Sch. of Eng., Tohoku Univ., Sendai, Japan
  • fYear
    2015
  • fDate
    16-18 June 2015
  • Abstract
    A novel damage recovery scheme using the oxygen showering post-treatment (OSP) is proposed to recover patterning damages and to improve electric and magnetic properties of p-MTJs, and its array yield. By applying our OSP to 25nm p-MTJs cell array, the MR was increased from 99% to 116% and the Isw was decreased from 41.1uA to 28.7uA. Moreover, electric short fails of MTJs array due to metallic by-products reduced dramatically by the selective oxidation of the damaged layer and its isolation from damage-less area. The OSP process makes the switching efficiency of 25nm patterned MTJs to be improved more than 30% compared with IBE treatment process. The mechanism of this enhancement is that spin directions of damaged area is changed from perpendicular to in-plane and, by this change, the energy barrier of damaged area is reduced. By the OSP treatment, we could develop the robust patterning process for sub-20nm STT-MRAM.
  • Keywords
    MRAM devices; electric properties; magnetic tunnelling; magnetoelectronics; semiconductor technology; IBE treatment process; OSP process; STT-MRAM; current 28.7 muA; current 41.1 muA; damage recovery scheme; electric properties; extreme damage suppression; high density p-MTJ array; magnetic properties; magnetic tunnel junction; oxygen showering posttreatment; oxygen showering process; patterning damages; size 20 nm; size 25 nm; spin transfer torque; Arrays; Magnetic properties; Magnetic tunneling; Market research; Oxidation; Switches; Thermal stability; Damage recovery; MRAM; MTJs; selective oxidation; short yield; switching efficiency;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Technology (VLSI Technology), 2015 Symposium on
  • Conference_Location
    Kyoto
  • ISSN
    0743-1562
  • Type

    conf

  • DOI
    10.1109/VLSIT.2015.7223660
  • Filename
    7223660