• DocumentCode
    1857561
  • Title

    Experiments and modelings of various recombination junction combinations in thin film tandem solar cells

  • Author

    Chiang, C.L. ; Yu, P.C. ; Shieh, J.M.

  • Author_Institution
    Dept. of Photonics, Nat. Chiao Tung Univ., Hsinchu, Taiwan
  • fYear
    2011
  • fDate
    19-24 June 2011
  • Abstract
    a-Si/a-Si tandem cells have a higher fill factor (FF), and lower light degradation than the single junction due to an intrinsic high electric field. Also, they are thinner and cheaper than a-Si single junction solar cells.[1] This paper presents experiment results of a-Si/a-Si tandem solar cells deposited by a High-Density Plasma Chemical Vapor Deposition (HDPCVD) and uses AMPS-1D to simulate the performance of different material compositions at the recombination junction (RJ), including n-a-Si/p-a-Si, n-a-Si/p-mc-Si, n-mc-Si/p-mc-Si, and n-mc-Si/p-a-SiC.[2,4] In the experiment, although we found that as the thickness of the n-a-Si and p-a-Si layers of the RJ decreased, and the flow rate of PH3 for the n-a-Si layer of the top cell lowered, the photocurrent (Jsc) and FF increased due to a reduced barrier height at the n-layer that facilitates the recombination and tunneling. The simulation results showed that the n-mc-Si/p-mc-Si composition had the best performance at the tunneling junction, and its highest efficiency could reach 10.4%.
  • Keywords
    elemental semiconductors; plasma CVD; semiconductor thin films; silicon; solar cells; thin film devices; AMPS-1D; FF; HDPCVD; electric field; fill factor; high-density plasma chemical vapor deposition; photocurrent; recombination junction; single junction solar cells; thin film tandem solar cells; tunneling junction; Doping; Electric fields; Junctions; Photovoltaic cells; Semiconductor process modeling; Simulation; Tunneling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photovoltaic Specialists Conference (PVSC), 2011 37th IEEE
  • Conference_Location
    Seattle, WA
  • ISSN
    0160-8371
  • Print_ISBN
    978-1-4244-9966-3
  • Type

    conf

  • DOI
    10.1109/PVSC.2011.6186023
  • Filename
    6186023