Fabrication and testing of a flat polymer micro heat pipe

Author

Oshman, C.J. ; Shi, B. ; Li, C. ; Yang, R.G. ; Lee, Y.C. ; Bright, V.M.

Author_Institution

Mech. Eng. Dept., Univ. of Colorado, Boulder, CO, USA

fYear

2009

fDate

21-25 June 2009

Firstpage

1999

Lastpage

2002

Abstract

A novel fabrication process is presented that uses liquid crystal polymer (LCP) film with copper filled thermal vias to construct a flat micro heat pipe (MHP) suitable for thermal management of semiconductor devices. LCP is chosen for its high chemical resistance, reliability, flexibility, and its ability to be readily incorporated into current mass production technologies. Copper filled thermal vias are formed in the evaporator and condenser regions of the MHP to decrease the thermal resistance of the LCP casing. In addition, a novel method for bonding woven mesh to liquid flow channels has been developed. The polymer MHP has been tested and the results show an average steady state effective thermal conductivity of 851 W/mmiddotK with an input heat flux of 3.0 W/cm².

Keywords

copper; heat pipes; liquid crystal polymers; thermal conductivity; thermal management (packaging); thermal resistance; Cu; chemical resistance; copper filled thermal vias; flexibility; liquid crystal polymer film; polymer microheat pipe; reliability; thermal conductivity; thermal management; thermal resistance; Chemical technology; Copper; Fabrication; Liquid crystal polymers; Polymer films; Semiconductor films; Testing; Thermal conductivity; Thermal management; Thermal resistance; Heat Pipe; Liquid Crystal Polymer; Thermal Management; Thermal Via; Vapor Chamber;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009. International

Conference_Location

Denver, CO

Print_ISBN

978-1-4244-4190-7

Electronic_ISBN

978-1-4244-4193-8

Type

conf

DOI

10.1109/SENSOR.2009.5285654

Filename

5285654