Title :
Design consideration and finite element modeling of MEMS cantilever for nano-biosensor applications
Author :
Klaitabtim, Don ; Tuantranont, Adisorn
Author_Institution :
Dept. of Appl. Phys., King Mongkut´´s Inst. of Technol., Bangkok, Thailand
Abstract :
This work has focused on the design and finite element modeling of a MEMS cantilever beam for biosensor applications. The stress induced on gold surface with polysilicon piezoresistive sensing is demonstrated. In principle, adsorption of biochemical species on a functionalized surface of the microfabricated cantilever will cause a surface stress and consequently the cantilever bending. The sensing mechanism relies on the piezoresistive properties of the polysilicon wire encapsulated in the beam. The beam is constructed and bending analysis is performed so that, the beam tip deflection could be predicted. The twelve independent beams were combined onto a single chip. The piezoresistor designs on the beams were varied, within certain constraints, so that the sensitivity of the sensing technique could be studied. The chip was laid out using Tanner L-edit and the design rules of the MUMPs process were followed. The device model was simulated using CoventorWareIM, a commercial finite element analysis (FEA) tool designed specifically for MEMS applications. Finally, the MEMS cantilever beam was operated and caused increment in tip deflection due to biochemical adsorption on the gold surface.
Keywords :
adsorption; beams (structures); bending; biochemistry; biosensors; cantilevers; elemental semiconductors; finite element analysis; micromechanical devices; nanotechnology; piezoresistance; piezoresistive devices; resistors; silicon; MEMS cantilever beam; MUMPs process; Si; beam tip deflection; biochemical adsorption; biochemical species; cantilever bending; chip; commercial finite element analysis; finite element modeling; gold surface; microfabricated cantilever; nano-biosensor applications; piezoresistive properties; piezoresistor design; polysilicon piezoresistive sensing; sensing mechanism; sensitivity; surface stress; Biosensors; Finite element methods; Gold; Mechanical factors; Micromechanical devices; Performance analysis; Piezoresistance; Stress; Structural beams; Wire;
Conference_Titel :
Nanotechnology, 2005. 5th IEEE Conference on
Print_ISBN :
0-7803-9199-3
DOI :
10.1109/NANO.2005.1500758