DocumentCode
1857738
Title
Teflon-carbon black as new material for the hydrophobic patterning of polymer labs-on-a-chip
Author
Riegger, L. ; Mielnik, M.M. ; Mark, D. ; Streule, W. ; Clad, M. ; Zengerle, R. ; Koltay, P.
Author_Institution
Dept. of Microsyst. Eng. (IMTEK), Univ. of Freiburg, Freiburg, Germany
fYear
2009
fDate
21-25 June 2009
Firstpage
2026
Lastpage
2029
Abstract
We provide a new method for the selective surface patterning of microfluidic chips with hydrophobic fluoropolymers which is demonstrated by the fabrication of hydrophobic valves. It enables efficient optical quality control for the surface patterning thus permitting the low-cost production of highly reproducible hydrophobic valves. Specifically, a fluoropolymer-solvent-dye solution based on carbon black (CB) is presented which creates superhydrophobic surfaces (contact angle = 157.9deg) on chips made from cyclic olefin copolymer (COC). It further provides good visibility for the quality control (QC) in polymer labs-on-a-chip and increases the burst pressure of hydrophobic valves. Finally, an application which aims for the amplification of mRNA on-chip and relies on the defined flow control by hydrophobic valves is presented. Here, the QC in combination with the Teflon-CB coating improves the average standard deviation of the burst pressures from 14.5% down to 6.1% compared to solely Teflon-coated valves.
Keywords
contact angle; flow control; hydrophobicity; polymer blends; valves; contact angle; cyclic olefin copolymer; fluoropolymer-solvent-dye solution; hydrophobic fmoropolymers; hydrophobic patterning; hydrophobic valves; microfiuidic chips; polymer labs-on-a-chip; quality control; selective surface patterning; superhydrophobic surfaces; teflon-carbon black; Automatic control; Coatings; Inspection; Lab-on-a-chip; Laboratories; Microfluidics; Polymers; Protocols; Quality control; Valves; flow control; hydrophobic valves; low-cost; quality control; superhydrophobic;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009. International
Conference_Location
Denver, CO
Print_ISBN
978-1-4244-4190-7
Electronic_ISBN
978-1-4244-4193-8
Type
conf
DOI
10.1109/SENSOR.2009.5285661
Filename
5285661
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