• DocumentCode
    1857767
  • Title

    A cross-junction channel valveless-micropump with integrated hotwires for fluidic application

  • Author

    Dau, V.T. ; Otake, T. ; Dinh, T.X. ; Tanaka, K. ; Amarasinghe, R. ; Sugiyama, S.

  • Author_Institution
    Grad. Sch. of Sci. & Eng., Ritsumeikan Univ., Kusatsu, Japan
  • fYear
    2009
  • fDate
    21-25 June 2009
  • Firstpage
    2030
  • Lastpage
    2033
  • Abstract
    This paper proposes a new valve-less pump with cross-junction channels and integrated hotwires. The pump was actuated by PZT diaphragm to create a gas jet flow for fluidic application. The design and simulation are based on transient fluidic analysis with experimental result of PZT diaphragm so that features of micropump is predicted with high reliability. Two designs of the pumps with different nozzles were investigated to study 3D nozzle effect. The micro pump was fabricated by standard MEMS process. Experiment was performed and agreement has been achieved between simulated and experimental results. The flow rate of 4.3 sccm was achieved at the driving voltage of 40 Vpp in frequency response of 7.9 kHz. The discharge pressure of 0.18 kPa was measured at 40 Vpp and the output voltage of the hotwire was 1.07 V at the constant applied voltage of 0.4 mA.
  • Keywords
    flow control; flow measurement; microactuators; microfluidics; micropumps; nozzles; piezoelectric actuators; 3D nozzle effect; MEMS process; PZT diaphragm; cross junction channel valveless micropump; current 0.4 mA; fluidic application; frequency 7.9 kHz; gas jet flow; integrated hotwires; nozzles; pressure 0.17 kPa; transient fluidic analysis; voltage 1.07 V; voltage 40 V; Analytical models; Frequency response; Immune system; Micromechanical devices; Micropumps; Predictive models; Pumps; Technological innovation; Transient analysis; Voltage; Cross-junction channel; hotwire; transient simulation; valve-less micro jet pump;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009. International
  • Conference_Location
    Denver, CO
  • Print_ISBN
    978-1-4244-4190-7
  • Electronic_ISBN
    978-1-4244-4193-8
  • Type

    conf

  • DOI
    10.1109/SENSOR.2009.5285662
  • Filename
    5285662