• DocumentCode
    1857840
  • Title

    III–V and Ge/strained SOI tunneling FET technologies for low power LSIs

  • Author

    Takagi, S. ; Kim, M. ; Noguchi, M. ; Ji, S.-M. ; Nishi, K. ; Takenaka, M.

  • Author_Institution
    Dept. of Electr. Eng. & Inf. Syst., Univ. of Tokyo, Tokyo, Japan
  • fYear
    2015
  • fDate
    16-18 June 2015
  • Abstract
    We have demonstrated high performance operation of planar-type tunnel field-effect transistors (TFETs) using Ge/ III-V materials. Tensile strain in Si channels combined with the Ge source can enhance the tunneling current because of the reduced effective bandgap. The fabricated Ge/sSOI (1.1 %) TFETs show high Ion/Ioff ratio over 107 and steep minimum subthreshold slope (SS) of 28 mV/dec. It is found that Ion and SS are improved by positive back bias. We have also demonstrated the operation of high Ion/Ioff and low SS planar-type InGaAs Tunnel FETs with Zn-diffused source junctions. Solid-phase Zn diffusion can realize steep-profile and defect-less p+/n source junctions. The small S.S. of 64 mV/dec and large Ion/Ioff ratio over 106 have been realized in the planar-type III-V TFETs.
  • Keywords
    III-V semiconductors; elemental semiconductors; field effect transistors; gallium arsenide; germanium; indium compounds; low-power electronics; silicon-on-insulator; tunnel transistors; zinc; Ge; InGaAs; SOI tunneling FET technologies; low power LSI; planar-type tunnel field-effect transistors; positive back bias; reduced effective bandgap; tensile strain; tunneling current; Indium gallium arsenide; Junctions; Logic gates; Photonic band gap; Silicon; Tunneling; Zinc;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Technology (VLSI Technology), 2015 Symposium on
  • Conference_Location
    Kyoto
  • ISSN
    0743-1562
  • Type

    conf

  • DOI
    10.1109/VLSIT.2015.7223687
  • Filename
    7223687